Electroforming

  • Electroforming is an electrochemical reduction process which allows to produce and reproduce an object that can be self-contained once it is separated from the substrate.
  • The applied electric current provokes a reduction-oxidation reaction of the metal ions between the cathode and the anode.
  • Electroplating is a process that limits the thickness of the layer, usually between 10-20 μm, but possibly as thin as 0.01 μm. It is used for decorative applications on an object.
  • Electroforming on the other hand deals with relatively thick layers of over 50 μm, usually between 100-300 μm.

 

Application

  • Creation of highly precise complex forms and hollow items.
  • A layer of a dozen of μm thick is enough to self-contain the object once it is separated from the substrate.
  • Precise reproduction of the wished shape.
  • Possibility to deposit on a rough surface.

Advantages

  • The thickness of the deposit isn’t limited. 
  • The deposit can be separated from the substrate.
  • A personalized after-sales service.

Disadvantage
   ·  Deposit time is longer than for electroplating.

 

Electroforming standard technology and operation flowtech01

Silver electroforming bath

  • Semi-bright thick Silver deposits.
  • Alkaline bath.  
  • Necessary to use Silver electrodes.
  • Electroforming bath can be operated at ambient  temperature.
  • No limit in thickness.
  • Fineness can reach 99.99%.
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Satin gold Bath

·     Gold electroforming process used specially for highly refined Satin gold deposition.

·     Operates at low temperature.

·     Neutral bath (Gold potassium cyanide).

·     No limit in thickness.

·     Fineness can reach 99.99 %.

·     Compatible with electroplating.

Hard gold bath

·     2 different baths: with or without cyanide.

·     Hardness > 140HV.

·     No limit in thickness.

·     Both baths are neutral.

Hard gold bath

  • 2 different baths: with or without cyanide.
  • Hardness > 140HV.
  • No limit in thickness.
  • Both baths are neutral.
  • Fineness can reach 99.99%.

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Gold bath

  •       The deposited layer contains one of the following combination: Au-Ag, Ag-Cu, Au-Cu-Ag, Au-Cu-Cd, Au-Cu-In. 
  •       The deposited layer can be of various colours, purity and thickness according to the metal used.
  •      In general, they are alkaline baths containing cyanides.
  •      The technician must be trained and experienced

 

Disadvantage

·     Deposit time is longer than for electroplating.